ʻUnilong
14 Makahiki o ka ʻIke Hana
Loaʻa iā ʻoe ʻelua mau hale hana kemika
Ua hala i ka ʻōnaehana maikaʻi ISO 9001:2015

4,4′-Methylenebis(2,6-dimethylphenylcyanate) CAS 101657-77-6


  • CAS:101657-77-6
  • Formula Molekala:C₁₉H₁₈N₂O₂
  • Kaumaha Molekala:306.36
  • Palapala:Pauka
  • Nā huaʻōlelo like:ʻO ka waikawa cyanic methylenebis(2,6-dimethyl-4,1-phenylene) ester; tetramethyl bisphenol f cyanate ester; METHYLENEBIS(2,6-DIMETHYL-4,1-PHENYLENE)ESTEROFCYANICA.; CYANICACID,METHYLENEBIS(2,6-DIMETHYL-4,1-PHENYLENE)EST.
  • Nā kikoʻī huahana

    Hoʻoiho

    Nā Lepili Huahana

    ʻIke Huahana

    Haʻahaʻa ka mānoanoa, maʻalahi ka hana ʻana: Ke ālai nei ka hui methyl i nā mana intermolecular, e hopena ana i ka mānoanoa heheʻe haʻahaʻa. He kūpono ʻo 4,4′-Methylenebis(2,6-dimethylphenylcyanate) (CAS 101657-77-6) no nā kaʻina hana RTM, winding, a me prepreg.
    Dielectric haʻahaʻa, kūpaʻa alapine kiʻekiʻe: Ma hope o ka hoʻōla ʻana, Dk ≈ 2.9, Df < 0.001 (10GHz). He haʻahaʻa loa ka pohō ma nā alapine kiʻekiʻe, e kūpono ana no nā hiʻohiʻona nalu millimeter 5G/6G.
    Ke kūpaʻa wela kiʻekiʻe, ka omo ʻana o ka makū haʻahaʻa: Tg ≈ 260–290 ℃, ka mahana lawelawe lōʻihi 190–220 ℃; ka nui o ka omo ʻana o ka wai < 0.8%, a kiʻekiʻe ka nui o ka paʻa ʻana o ka hana i nā wahi wela haʻahaʻa.
    ʻAʻohe ʻawahia, ʻaʻohe BPA: He pani bisphenol A, me ka ʻole o nā pilikia hoʻopilikia endocrine, a me ka palekana kiʻekiʻe.

    Nā kikoʻī

    Mea Nā kikoʻī
    CAS 101657-77-6
    Palapala Pauka
    Ka nui o ka paʻa 1.14
    Wahi lapalapa 162°C

    Noi

    1. Laminate i uhi ʻia me ke keleawe wikiwiki kiʻekiʻe (core)
    Hoʻohana ʻia ʻo 4,4′-Methylenebis (2,6-dimethylphenylcyanate) i nā papa antenna kahua kahua 5G/6G, nā papa radar nalu millimeter, a me nā PCB kikowaena wikiwiki, e pani ana iā BADCy / epoxy, e hōʻemi nui ana i ka nalowale o ka hōʻailona a hoʻonui i ka wikiwiki o ka hoʻoili ʻana.
    ʻElele: Laminate i uhi ʻia i ke keleawe me ka resin hydrocarbon, ka resin matrix o ka papa composite PTFE kiʻekiʻe-alapine.
    2. ʻO ka hoʻopili uila kiʻekiʻe a me nā substrates
    ʻO ka substrate package chip 4,4′-Methylenebis(2,6-dimethylphenylcyanate), papa lawe IC, mea hoʻohui alapine kiʻekiʻe, mea hoʻokaʻawale insulating, kūpono no ka hoʻopili ʻana i ke kiʻekiʻe wela me ke kēpau ʻole a me nā kūlana wela humid lōʻihi.
    3. Nā mea hana hui kiʻekiʻe a me nā uhi
    4,4′-Methylenebis(2,6-dimethylphenylcyanate) mea pale ablative, uhi insulation wela kiʻekiʻe, mea pale electromagnetic; copolymerized me ka epoxy / BMI e kaulike i ke kumukūʻai a me ka hana.

    ʻŌpala a me ka hoʻouna ʻana

    • Ka Hoʻopili Maʻamau: 25 kg/ʻeke; 25 kg/pahu
    • MOQ: e hōʻoia ʻia e ka papa a me ka wahi i manaʻo ʻia
    • Manawa Alakaʻi: e hōʻoia ʻia e ka nui o ke kauoha a me ka papa hana hana
    • Hoʻouna: loaʻa nā koho kai / ea / wikiwiki

    Ka Mālama ʻana a me ka Lawelawe ʻana

    • E mālama i kahi anu, maloʻo, a me kahi ea maikaʻi.
    • E pani pono i ka ipu a pale ʻia mai ka makū.
    • E pale i ka lā pololei, ka wela, a me ke ahi ākea.
    • E hahai i ke alakaʻi SDS no nā mea kūpono ʻole.


  • Ma mua:
  • Aʻe:

    E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou